semix854gb176hds ? by semikron rev. 1 ? 24.06.2010 1 semix ? 4s gb trench igbt modules semix854gb176hds features ? homogeneous si ? trench = trenchgate technology ?v ce(sat) with positive temperature coefficient ? ul recognised file no. e63532 typical applications* ? ac inverter drives ?ups ? electronic welders absolute maximum ratings symbol conditions values unit igbt v ces 1700 v i c t j = 150 c t c =25c 779 a t c =80c 549 a i cnom 600 a i crm i crm = 2xi cnom 1200 a v ges -20 ... 20 v t psc v cc = 1000 v v ge 20 v v ces 1700 v t j = 125 c 10 s t j -55 ... 150 c inverse diode i f t j = 150 c t c =25c 740 a t c =80c 496 a i fnom 600 a i frm i frm = 2xi fnom 1200 a i fsm t p = 10 ms, sin 180, t j =25c 3800 a t j -40 ... 150 c module i t(rms) 600 a t stg -40 ... 125 c v isol ac sinus 50hz, t = 1 min 4000 v characteristics symbol conditions min. typ. max. unit igbt v ce(sat) i c =600a v ge =15v chiplevel t j =25c 22.45v t j = 125 c 2.45 2.9 v v ce0 t j =25c 11.2v t j = 125 c 0.9 1.1 v r ce v ge =15v t j =25c 1.7 2.1 m ? t j = 125 c 2.6 3.0 m ? v ge(th) v ge =v ce , i c = 24 ma 5.2 5.8 6.4 v i ces v ge =0v v ce = 1700 v t j =25c 4ma t j = 125 c ma c ies v ce =25v v ge =0v f=1mhz 52.8 n f c oes f=1mhz 2.20 nf c res f=1mhz 1.75 nf q g v ge =- 8 v...+ 15 v 5600 nc r gint t j =25c 1.25 ? t d(on) v cc = 1200 v i c =600a r g on =2 ? r g off =2 ? t j = 125 c 340 n s t r t j = 125 c 80 ns e on t j = 125 c 395 mj t d(off) t j = 125 c 890 n s t f t j = 125 c 155 n s e off t j = 125 c 235 mj r th(j-c) per igbt 0.045 k/w
semix854gb176hds 2 rev. 1 ? 24.06.2010 ? by semikron characteristics symbol conditions min. typ. max. unit inverse diode v f = v ec i f =600a v ge =0v chip t j =25c 1.7 1.90 v t j = 125 c 1.7 1.9 v v f0 t j =25c 0.9 1.1 1.3 v t j = 125 c 0.7 0.9 1.1 v r f t j =25c 1.0 1.0 1.0 m ? t j = 125 c 1.3 1.3 1.3 m ? i rrm i f =600a di/dt off = 8000 a/s v ge =-15v v cc = 1200 v t j = 125 c 730 a q rr t j = 125 c 220 c e rr t j = 125 c 170 mj r th(j-c) per diode 0.081 k/w module l ce 22 nh r cc'+ee' res., terminal-chip t c =25c 0.7 m ? t c = 125 c 1m ? r th(c-s) per module 0.03 k/w m s to heat sink (m5) 3 5 nm m t to terminals (m6) 2.5 5 nm nm w 400 g temperatur sensor r 100 t c =100c (r 25 =5 k ? ) 493 5% ? b 100/125 r (t) =r 100 exp[b 100/125 (1/t-1/t 100 )]; t[k]; 3550 2% k semix ? 4s gb trench igbt modules semix854gb176hds features ? homogeneous si ? trench = trenchgate technology ?v ce(sat) with positive temperature coefficient ? ul recognised file no. e63532 typical applications* ? ac inverter drives ?ups ? electronic welders
semix854gb176hds ? by semikron rev. 1 ? 24.06.2010 3 fig. 1: typ. output ch aracteristic, inclusive r cc'+ ee' fig. 2: rated current vs. temperature i c = f (t c ) fig. 3: typ. turn-on /-off energy = f (i c ) fig. 4: typ. turn-on /-off energy = f (r g ) fig. 5: typ. transfer characteristic fig. 6: typ. gate charge characteristic
semix854gb176hds 4 rev. 1 ? 24.06.2010 ? by semikron fig. 7: typ. switching times vs. i c fig. 8: typ. switching times vs. gate resistor r g fig. 9: typ. transient thermal impedance fig. 10: typ. cal diode forward charact., incl. r cc'+ee' fig. 11: typ. cal diode peak reverse recovery current fig. 12: typ. cal diode recovery charge
semix854gb176hds ? by semikron rev. 1 ? 24.06.2010 5 this is an electrostatic discharge sensitive device (esds), international standard iec 60747-1, chapter ix * the specifications of our components may not be considered as an assurance of component characteristics. components have to b e tested for the respective application. adjustments may be necessary. t he use of semikron products in life support appliances and syste ms is subject to prior specification and written approval by semikron . we therefore strongly recommend prior consultation of our pers onal. semix 4s spring configuration
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